Tag-Archive for ◊ usb 3.0 ◊

AMD Hudson Chipset to Get USB 3.0?
Friday, July 30th, 2010 | Author: Grace

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As Intel evidently won’t be offering USB 3.0 as chipset integrated feature until 2012, AMD is taking the opportunity to slap its nemesis in the face by integrating USB 3.0 into its upcoming mobile PC platform. The said platform is code-named Hudson D1 which serves as the southbridge chip for Ontario and Llano APUs – AMD’s CPU/GPU fusion. It is slated to ship in Q4 2010, and will primarily target at thin-notebooks and notebooks.
Rumor has it that AMD is in talks with NEC to license its proven USB 3.0 chipset in order to save R&D money into developing its own solution. NEC seems like an ideal partner as the fab manufacturer has the capacity to ramp up production as soon as orders are received. The talk comes at a time when Intel at last released xHCI spec 1.0 which finalizes the details of the register-level interface for host controller driver in software. The move by AMD will undoubtedly drive the cost per unit even lower to perhaps under $2, and will likely create an incentive for more first-tier manufacturers to adopt SuperSpeed USB.

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USB 3.0 RAID 2.5″ Enclosure
Tuesday, June 29th, 2010 | Author: Grace

 

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Storage maven inXtron adds to its line of USB 3.0 devices with the Orbit. Not to be confused with the Altec Lansing Orbit speaker, this Orbit is a 2.5 hard drive enclosure built for two 2.5″ drives. They’ve developed this closely with Gigabyte, who is leading the way with many USB 3.0 implementations; and Silicon Image who is providing its SteelVine Series 3 Core storage technology. These drives can be configured to run in RAID configurations 0 and 1 as well as JBOD. RAID 1 mirroring is an ideal use for this device as a great method to handle drive failures for critical data. Unfortunately, even the best RAID 1 device sacrifices speed for security. Duplicating the data across disks is done real-time and can effectively take twice as long as normal.
RAID 0 is where this drive will really smoke. The USB 3.0 bandwidth can really be exploited with the dual write, striping operations permitted by RAID 0. USB 3.0 should provide plenty of power to be able to run both drives solely with bus power. There’s not much more detail at this time so release may be far off. Hopefully no more than a few months will pass before we can get our hands on one.

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Intel delaying USB 3.0 chips until 2011
Thursday, November 26th, 2009 | Author: Grace

Intel Corp.’s decision to wait until 2011 to support USB 3.0 in PC chipsets will put the wide adoption of the interconnect on hold for a year, said a senior technology manager at a top tier PC maker.

The issue is the second to dog a major USB initiative, following the virtual collapse of UWB-based wireless USB which is effectively dead, said the source who asked not to be named. In its place, interest is now building for 60GHz technology, but separate industry groups need to unite to ensure the future of it, he added.
 
Without chipset support from Intel for USB 3.0 aka SuperSpeed USB, adoption in 2010 will be limited to “a few high-end graphics workstations and consumer systems,” said the source. That’s because system makers will be forced to buy discrete host controllers for their motherboards, a relatively high cost.

“It’s hard to commit to an emerging technology like this when the key silicon enablers are not making it a priority,” said the source, referring to Intel. “You get into a chicken-and-egg situation,” he added.
 
The 5GHz USB 3.0 spec got plenty of attention at the Intel Developer Forum last month with a dozen chip, system and software vendors showing products with throughput up to 250MBps.
 
At the time one source said Intel originally planned to sample chipsets supporting USB 3.0 in early 2010, then shifted its plans out a year. The PC technology manager confirmed that report. An Intel spokesperson said he had not heard of any delay, but declined further comment.
 
USB 3.0 “won’t get real traction until it gets integrated in the chipsets,” said the PC manager.
 
That poses a problem for a handful of chip makers rolling out products such as storage controllers for the technology. But it would not be the first time Intel and Microsoft initiative managers have rallied the industry to support a new spec only to have their own key product teams move slowly to adopt it.
 
The Microsoft and Intel “tech and strategy groups are not always aligned with the product development teams that are in the mode of trying to make revenue and prioritize what to integrate,” the PC manager said.
 
Intel’s chipset teams are currently focused on supporting Nehalem, Intel’s first processor to use an integrated memory controller. They also are working through a transition to the 5GHz PCIe 2.0 spec.
 
“They need to prioritize their time and resources on a whole host of things and have to consider the compelling needs for USB 3.0 now versus 18 months later,” the source said.
 
Lost UWB
Meanwhile the push for wireless USB has “lost its window of opportunity,” said the PC manager, pointing to the closure of many startups and an industry group backing it. Indeed, one market watcher predicted UWB in general will virtually die off by 2013.
 
“Now with 60GHz technology getting a lot of executive ear time, we don’t believe UWB will gain traction,” the PC manager said.
 
However, 60GHz is no slam dunk as the next big wireless interface for systems, he added. Contention over the market direction for the technology between the Wireless Gigabit Alliance and the Wireless HD could slow or even derail adoption, he said.
 
“It’s a discontinuity in the industry, and we are not interested in supporting multiple organizations for one technology,” he said. “The companies in both groups need to take a mature, adult approach and merge the two,” he added.
 
On the technical front, a handful of 60GHz startups should leverage existing UWB silicon technologies so they can concentrate their efforts on the challenge of designing 60GHz radios in CMOS, he said. Existing 60GHz startups are wasting time and resources designing baseband and media access controllers rather than licensing available IP.
 
“I’ve seen this movie ten times before,” he added.
 
Besides SiBeam, one of the early pioneers in 60GHz, Beam Networks in Tel Aviv and a startup called Nitero in Australia are among those developing 60GHz chips.
 
PC makers believe 60 GHz offers uses for TV, PC and handheld systems in the home and for office PCs that don’t need a wired link to external monitors.
 
The Wi-Fi Alliance could act as a certification and testing agency for the technology, the source said. He believes if all goes well it could make it into mainstream products in late 2011.

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Asus Moves USB 3.0 to a Brand New Mobo
Friday, October 30th, 2009 | Author: Grace

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Hot on the heels of the Gigabyte announcement yesterday, Asus has re-announced its production of a pair of motherboards packing USB 3.0. Great news on the heels of the Intel production delay last week. The two Asus motherboards, the P7P55D-E and P7P55D are built for Intel’s latest Core i5 and i7 processors. The P7P55D-E is the big dog of the two and carries USB 3.0 and the new 6GB/s SATA support on-board. The P7P55D has the same 2 hot new features but only when accompanied by their U3S6 expansion board. This mobo actually was announced 2 months ago along with the SATA 6GB/s expansion card. Whatever setback they had on the original P6X58, which was unexpectedly cancelled, has been overcome on the P7P55D-E as well as being added to the daughter card.
Asus, we still love you, you still have our hearts from the eee. But considering that Gigabyte hasn’t broken our heart, we’re putting you on notice. One more mix up and we’ll drop you like a hot soldering iron. The Gigabyte mobo boasts most of the same specs. The race is on now between the P55A and the P7P55D motherboards to see who will be the first on sale.

Category: USB Products  | Tags: ,  | Leave a Comment
128GB USB Flash Drive is coming
Tuesday, July 14th, 2009 | Author: Arthur Matthew

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Let’s face it – you can’t get enough of storage. When you think your brand new 32GB flash drive has you covered, you will soon find new ways to fill it up, such as backing up the whole system for data recovery on the go. Before you know it, you will be googling your next thumbdrive again. Kingston will be shipping a 128GB flash drive – the largest capacity yet as of this writing.

Designated DT200, the series also comprises of 32GB and 64GB, has a capless design, comes with five-year warranty, and includes data protection that is less likely going to rival that of Ironkey. It’s not going to matter anyway since most recovery software already incorporates some form of AES encryption. Keep in mind the 128GB is build-to-order only, and Kingston asks for a staggering $546, not to mention the drive is limited to USB 2.0. (Where is SuperSpeed USB when we need it?) As for the other two, the same company has been selling 32GB and 64GB that belong to the DT150 at a relatively attractive price.

USB 3.0 Maybe Support 25Gbps
Monday, June 22nd, 2009 | Author: Arthur Matthew

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Even though USB 3.0’s top speed is 4.8Gbps, we may not have to wait for USB 4.0 to reach even faster speed. According to Jeff Ravencraft – the chairman of USB Promoter Group – was discussing the possibility of increasing the speed of USB 3.0 without a complete rewrite such as USB 3.0 itself and 2.0. He claimed USB 3.0 was designed with transmission protocol to support speed of up to 25Gbps.

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While he couldn’t specify when USB 3.0 (aka. SuperSpeed USB) will hit that mark, he did imply the current 4.8Gbps speed will be enough for the next few years (likely within 5). It’s very possible that SSDs will be mainstream by then, and they are going to easily saturate USB 3.0 bandwidth. Perhaps we might only see a minor upgrade to USB 3.1 yet speed boost could be 3 to 4 times faster than what USB 3.0 currently offers.

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World’s First USB 3.0 Host Controller has born!
Wednesday, June 03rd, 2009 | Author: Grace

resize1Imagine uploading an entire HD movie to your laptop in just over a minute. Imagine downloading all the 100-plus MP3 files of an audiobook to your player in seconds. How about getting the latest video from your camcorder to your desktop ready to mash up almost instantaneously, so you can beat your buddies onto YouTube? Sounds great, right?

That’s what the developers of the next-generation Universal Serial Bus technology are counting on when they release the spec for USB 3.0—also known as SuperSpeed USB.

Manufacturers are already gearing up for SuperSpeed USB with NEC being the first to announce the first USB 3.0 host controller, which is about one of the few silicon products that will guarantee instant success in this economy. NEC Electronics expects external hard drives, SSDs, flash drives and of course the computers themselves will be the first to receive the SuperSpeed USB upgrade.

A demo by Seagate at CES 2009 has already shown that even a prototype can reach upwards of 165MB/s which in perspective is almost 5 times faster than the fastest USB hard drive or flash drive. If USB 2.0 chip optimization history is any indication, we are looking at USB 3.0 hitting top speed in two years. Designated µPD720200, the world’s first xHCI-compliant host silicon will also be backward compatible with USB 1.1 and USB 2.0. Samples of the chips will become available in June 2009 at $15 USD, along with free Windows drivers. NEC anticipates monthly production to reach one million units by September of this year, and rapid adoption in second half of 2010.

New time of  USB is coming!