Tag-Archive for ◊ USB News ◊

SuperSpeed USB 10 Gbps – Ready
Tuesday, August 27th, 2013 | Author: Elaine

SuperSpeed USB 10 Gbps – Ready for Development
USB 3.0 Promoter Group announced availability of the USB 3.1 Specification to increase SuperSpeed USB to 10 Gbps HILLSBORO, Ore. – July 31, 2013 – The USB 3.0 Promoter Group today announced the
completion of the USB 3.1 Specification which adds enhancements to enable SuperSpeed USB to operate at up to 10 Gbps. This latest release of the specification will be available today for download from the USB Implementers Forum (USB-IF) website. SuperSpeed USB 10 Gbps uses a more efficient data encoding and will deliver more than twice the effective data through-put performance of existing SuperSpeed USB over
enhanced, fully backward compatible USB connectors and cables. Compatibility is assured with existing USB 3.0 software stacks and device class protocols as well as with existing 5 Gbps hubs and devices and USB 2.0 products. Developers interested in implementing the new USB 3.1 Specification have the opportunity to learn technical details during three developer conferences currently being planned. The
international conferences planned in Europe and Asia will offer more advanced system design training as breakout sessions on the second day. For more details and conference
registration instructions, please visit the USB-IF website.
1. USB 3.1 Developers Day US – August 21, 2013 in Hillsboro, Ore.
2. USB 3.1 Developers Days Europe – October 1-2, 2013 in Dublin, Ireland
3. USB 3.1 Developers Days Asia – Two day conference scheduled for early December
2013, more details to follow
“The USB 3.1 specification primarily extends existing USB 3.0 protocol and hub operation for speed scaling along with defining the next higher physical layer speed as 10 Gbps,” said Brad Saunders, USB 3.0 Promoter Group Chairman. “The specification team worked hard to make sure that the changes made to support higher speeds were limited and remained consistent with existing USB 3.0 architecture to ease product development.”
“We recognize this advancement in USB technology is an important development for our customers,” said Tom Bonola, Chief Technology Officer, Business PC Solutions, HP. “The USB 3.1 Specification enables us to meet the growing needs of our customers for faster data transfer while maintaining backwards compatibility with existing devices.”
“The industry has affirmed the strong demand for higher through-put, for user-connected peripherals and docks, by coming together to produce a quality SuperSpeed USB 10 Gbps specification,” said Alex Peleg, Vice President, Intel Architecture Group. “Intel is fully committed to deliver on this request.”
“While maintaining backward compatibility, USB continues to advance to meet customer’s growing need for higher speed data” said Roland Sperlich, TI Consumer and Computing Interface Product Line Manager. “The 10 Gbps data rate allows designers across many industries to do more with a universal standard.”
“In this multi-device world, the USB 3.1 updates will enable end-users to move content across devices quickly, conveniently and without worrying about compatibility,” said Emile Ianni, Corporate Vice President of Platform Solutions Engineering, AMD. “AMD thanks our engineers as well as the other technology contributors for bringing to market robust innovation that is designed to work seamlessly with new and existing solutions.”
About the USB 3.0 Promoter Group
The USB 3.0 Promoter Group, comprised of Hewlett-Packard Company, Intel Corporation, Microsoft Corporation, Renesas Electronics, ST-Ericsson and Texas Instruments, developed the USB 3.0 Specification that was released in November 2008. In addition to maintaining and enhancing this specification, the USB 3.0 Promoter Group develops specification addendums to extend or adapt its specifications to support more platform types or use cases where adopting USB 3.0 technology will be beneficial in delivering a more ubiquitous, richer user experience.
About the USB-IF
The non-profit USB Implementers Forum, Inc. was formed to provide a support organization and forum for the advancement and adoption of USB technology. The USB-IF facilitates the development of high-quality compatible USB devices through its logo and compliance program, and promotes the benefits of USB and the quality of products that have passed compliance testing. Further information, including postings of the most recent product and technology announcements, is available by visiting the USB-IF website at www.usb.org.

via usb.org

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SIIG Released USB 3.0 Gigabit Ethernet Adapter
Wednesday, January 16th, 2013 | Author: Grace

As we may know, all Windows 8 tablets and majority of Ultrabooks do not accompany intrinsic local area network, including one supporting Gigabit. this might not vex you initially since we tend to ar therefore wont to local area network however this annoying omission can return to haunt you once checking into a chamber solely to seek out out net property is provided by local area network solely.Now there are adapters though they’re restricted to USB  2 .0, going away Gigabit out of the question. it is a long term coming back however SIIG finally ships a USB 3.0 Gigabit Adapter – for each Windows and Macs. The external local area network electronic device – power-driven by ASIX AX88179 – wants 900mA from a USB 3.0 port; although it isn’t sure if it wants all that power to show on the Gigabit mode extra options embrace Wake-on-LAN; power saving mode once cable is unplugged; and diagnostic LEDs.


Incidentally, SIIG claims the electronic device comes with waterproof support (10.6.x or later). If you own a recently discharged MacBook, then there is continually the Thunderbolt to Gigabit local area network Adapter. The SIIG USB 3.0 to Gigabit local area network Adapter – backed by a 5-year assurance – is currently obtainable for around $33, considerably under it’s $49.99 MSRP.

The 2013 CES is held from Jan 8th, 2013 to Jan 11th 2013. The USB 3.0 Promoter Group announced to the Media that they will add a much higher data rate and much larger Capabilities.

The data transfer speed will doubles and the new USB 3.0 will be fully backward compatible with USB 2.0 and USB connectors and USB cables. It is said that the specification will be released in the middle of this year.

Let’s have a overview of the USB 3.0 hightlights.

  • New 10 Gbps USB data rate
  • Compatibility with existing cables and connectors
  • Improved data encoding for more efficient data transfer leading to higher through-put and improved I/O power efficiency
  • Compatible with existing USB 3.0 software stacks and device class protocols
  • Compatible with both existing 5 Gbps and new 10 Gbps USB 3.0 hubs and devices, as well as USB 2.0 products

The USB 3.0 is called SuperSpeed USB. The Chairman of the USB group hopes to best improve user experience and connectivity performance. The SuperSpeed USB will be more efficient for the more emerging USB applications and hardware.

Let us expect the 10 Gbps USB. And we will embrace the convenience that it brings to us.

Paper USB will be Developed
Saturday, January 05th, 2013 | Author: Elaine

The intelliPaper Technology launched the Paper USB flash drive recently. The little flash driives put the USB connectors and the storage chipset in a much thinner piece of paper. It is the thinnest usb flash drive that I ever heard.

It is incredible that you can storage data on papers. It is not only small but also light. This can open the imagination to apply the paper usb as many kinds of gift cards, invitation cardstock and event tickets or travel tickets even bus tickets. Just think of whatever paper file for display as possible as you can.


The company, intelliPaper is seeking partners to raise the project before bringing it to the market. But you still need to notice that the capacity of these paper devices is not so big, ranging from 8 to 32MB.

Intel delaying USB 3.0 chips until 2011
Thursday, November 26th, 2009 | Author: Grace

Intel Corp.’s decision to wait until 2011 to support USB 3.0 in PC chipsets will put the wide adoption of the interconnect on hold for a year, said a senior technology manager at a top tier PC maker.

The issue is the second to dog a major USB initiative, following the virtual collapse of UWB-based wireless USB which is effectively dead, said the source who asked not to be named. In its place, interest is now building for 60GHz technology, but separate industry groups need to unite to ensure the future of it, he added.
Without chipset support from Intel for USB 3.0 aka SuperSpeed USB, adoption in 2010 will be limited to “a few high-end graphics workstations and consumer systems,” said the source. That’s because system makers will be forced to buy discrete host controllers for their motherboards, a relatively high cost.

“It’s hard to commit to an emerging technology like this when the key silicon enablers are not making it a priority,” said the source, referring to Intel. “You get into a chicken-and-egg situation,” he added.
The 5GHz USB 3.0 spec got plenty of attention at the Intel Developer Forum last month with a dozen chip, system and software vendors showing products with throughput up to 250MBps.
At the time one source said Intel originally planned to sample chipsets supporting USB 3.0 in early 2010, then shifted its plans out a year. The PC technology manager confirmed that report. An Intel spokesperson said he had not heard of any delay, but declined further comment.
USB 3.0 “won’t get real traction until it gets integrated in the chipsets,” said the PC manager.
That poses a problem for a handful of chip makers rolling out products such as storage controllers for the technology. But it would not be the first time Intel and Microsoft initiative managers have rallied the industry to support a new spec only to have their own key product teams move slowly to adopt it.
The Microsoft and Intel “tech and strategy groups are not always aligned with the product development teams that are in the mode of trying to make revenue and prioritize what to integrate,” the PC manager said.
Intel’s chipset teams are currently focused on supporting Nehalem, Intel’s first processor to use an integrated memory controller. They also are working through a transition to the 5GHz PCIe 2.0 spec.
“They need to prioritize their time and resources on a whole host of things and have to consider the compelling needs for USB 3.0 now versus 18 months later,” the source said.
Lost UWB
Meanwhile the push for wireless USB has “lost its window of opportunity,” said the PC manager, pointing to the closure of many startups and an industry group backing it. Indeed, one market watcher predicted UWB in general will virtually die off by 2013.
“Now with 60GHz technology getting a lot of executive ear time, we don’t believe UWB will gain traction,” the PC manager said.
However, 60GHz is no slam dunk as the next big wireless interface for systems, he added. Contention over the market direction for the technology between the Wireless Gigabit Alliance and the Wireless HD could slow or even derail adoption, he said.
“It’s a discontinuity in the industry, and we are not interested in supporting multiple organizations for one technology,” he said. “The companies in both groups need to take a mature, adult approach and merge the two,” he added.
On the technical front, a handful of 60GHz startups should leverage existing UWB silicon technologies so they can concentrate their efforts on the challenge of designing 60GHz radios in CMOS, he said. Existing 60GHz startups are wasting time and resources designing baseband and media access controllers rather than licensing available IP.
“I’ve seen this movie ten times before,” he added.
Besides SiBeam, one of the early pioneers in 60GHz, Beam Networks in Tel Aviv and a startup called Nitero in Australia are among those developing 60GHz chips.
PC makers believe 60 GHz offers uses for TV, PC and handheld systems in the home and for office PCs that don’t need a wired link to external monitors.
The Wi-Fi Alliance could act as a certification and testing agency for the technology, the source said. He believes if all goes well it could make it into mainstream products in late 2011.

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Windows 7 Sold in Flash Disk
Monday, July 20th, 2009 | Author: Elaine Lee


There’s a rumor circulating in the blogsphere that MS is planning to offer Windows 7 on a flash drive which would make it third way to get the OS without buying a new PC. The other two are through download & retail DVD. While the decision is still being made, this move is being considered in the first place to appeal to the ever growing netbook crowd whose under-powered machines usually lack any optical media drive.

Having said that, thumbdrives logically become the easiest, not to mention fastest route to get Windows 7 running on a netbook. In fact, they have already become the unofficial install method for XP, Vista and now 7 if you are comfortable with command prompt. If tweakers can teach newbies to do it in 10 minutes, it should be dead easy for MS to get a Windows 7 thumbdrive package ready.

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Displaylink Linux News

In a move that has the Open Source movement cheering, DisplayLink has released the source code for the Linux port of its software. DisplayLink makes the hardware that supports the majority of peripheral video devices in the personal computer world. Responsible for USB video adapters, USB monitors and USB docking stations with video support, DisplayLink has also been responsible for developing the device driver s for their hardware. Their disclosure will allow the Linux community to pick up the development of the drivers at whatever pace public interest warrants.

Currently the Linux community has to wait, and usually comes last if at all when it comes to hardware driver support. Having a very small, but constantly growing user base, Linux usually represents too small of a revenue share for companies to invest too much time and money developing drivers to support them. The frustrating part is that the Linux community, rife with developers of their own is perfectly capable of supporting themselves. This release will give them what they need to support themselves. While open source market share is very low, innovation is very high and many popular software packages started as Open Source projects which were commercialized after they gained enough popularity. Hopefully this move will yield exciting new uses of an already useful product space.

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